Title of article
Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions
Author/Authors
K. N. SUBRAMANIAN، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
12
From page
420
To page
431
Keywords
TMF. , Solder , damage , Anisotropy , lead-free
Journal title
Fatigue and Fracture of Engineering Materials and Structures
Serial Year
2007
Journal title
Fatigue and Fracture of Engineering Materials and Structures
Record number
360041
Link To Document