مرکز منطقه ای اطلاع رساني علوم و فناوري - Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions

Title of article :

Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions

Author/Authors :

K. N. SUBRAMANIAN، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2007

Pages :

From page :

420

To page :

431

Keywords :

TMF. , Solder , damage , Anisotropy , lead-free

Journal title :

Fatigue and Fracture of Engineering Materials and Structures

Serial Year :

2007

Journal title :

Fatigue and Fracture of Engineering Materials and Structures

Record number :

360041

Link To Document :