مرکز منطقه ای اطلاع رساني علوم و فناوري - Study of failure modes of microelectronic packaging modules by holography quasi projection moire method

Title of article :

Study of failure modes of microelectronic packaging modules by holography quasi projection moire method

Author/Authors :

Shi Xunqing، نويسنده , , Liu Baochen ، نويسنده , , Dai Fulong ، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 1997

Pages :

From page :

179

To page :

185

Keywords :

packagingmodules , quasi projection moire , Failure modes , sensitivity , Holography

Journal title :

Acta Mechanica Sinica

Serial Year :

1997

Journal title :

Acta Mechanica Sinica

Record number :

360124

Link To Document :