Title of article
Study of thermal deformation of microelectronics packaging product by interferometric technique
Author/Authors
Qing Xinlin، نويسنده , , Wang Guotao ، نويسنده , , Dai Fulong ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1997
Pages
7
From page
186
To page
192
Keywords
electronic packaging , Thermal deformation , Twyman/Green interferometry , Moire interferometry.
Journal title
Acta Mechanica Sinica
Serial Year
1997
Journal title
Acta Mechanica Sinica
Record number
360125
Link To Document