مرکز منطقه ای اطلاع رساني علوم و فناوري - Study of thermal deformation of microelectronics packaging product by interferometric technique

Title of article :

Study of thermal deformation of microelectronics packaging product by interferometric technique

Author/Authors :

Qing Xinlin، نويسنده , , Wang Guotao ، نويسنده , , Dai Fulong ، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 1997

Pages :

From page :

186

To page :

192

Keywords :

electronic packaging , Thermal deformation , Twyman/Green interferometry , Moire interferometry.

Journal title :

Acta Mechanica Sinica

Serial Year :

1997

Journal title :

Acta Mechanica Sinica

Record number :

360125

Link To Document :