مرکز منطقه ای اطلاع رساني علوم و فناوري - Molecular dynamics study of adhesion strength and diffusion at interfaces between interconnect materials and underlay materials

Title of article :

Molecular dynamics study of adhesion strength and diffusion at interfaces between interconnect materials and underlay materials

Author/Authors :

T. Iwasaki ، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2000

Pages :

From page :

To page :

Journal title :

Computational Mechanics

Serial Year :

2000

Journal title :

Computational Mechanics

Record number :

364061

Link To Document :