• Title of article

    Kinetics study of thermal decomposition of electronic packaging material

  • Author/Authors

    Tzong-Horng Liou، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2004
  • Pages
    13
  • From page
    39
  • To page
    51
  • Keywords
    Electronic packaging material , thermal decomposition , Kinetics , silica , Mechanism
  • Journal title
    Chemical Engineering Journal
  • Serial Year
    2004
  • Journal title
    Chemical Engineering Journal
  • Record number

    365835

    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=365835