Title of article :
Quality investigation of joint of bipolar transistor chip and lead frame by thermal wave method
Author/Authors :
Suszynski، نويسنده , , Z.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1997
Journal title :
I E T Circuits, Devices and Systems
Journal title :
I E T Circuits, Devices and Systems
