مرکز منطقه ای اطلاع رساني علوم و فناوري - A Study of Thermal Stress and Intrinsic Residual Stress in Planar Metallization for Integrated Power Modules

Title of article :

A Study of Thermal Stress and Intrinsic Residual Stress in Planar Metallization for Integrated Power Modules

Author/Authors :

Ning Zhu، نويسنده , , Jacobus Daniel van Wyk، نويسنده , , Zhenxian Liang، نويسنده , , and Willem G. Hardus Odendaal، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2005

Pages :

From page :

1603

To page :

1611

Keywords :

planar metallization , thermomechanical stress. , Intrinsic residual stress

Journal title :

IEEE Transactions on Industry Applications

Serial Year :

2005

Journal title :

IEEE Transactions on Industry Applications

Record number :

381834

Link To Document :