Title of article :
Integrating nanowires with substrates using directed assembly and nanoscale soldering
Author/Authors :
Hongke Ye، نويسنده , , Zhiyong Gu، نويسنده , , Yu، نويسنده , , T.، نويسنده , , Gracias، Nuno نويسنده , , D.H.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2006
Pages :
5
From page :
62
To page :
66
Keywords :
Directed assembly , electrical contact , magneticassembly , Nanotechnology , solder reflow , very large scale integration (VLSI). , Semiconductor devices , Nanoelectronics
Journal title :
IEEE Transactions on Nanotechnology
Serial Year :
2006
Journal title :
IEEE Transactions on Nanotechnology
Record number :
398804
Link To Document :
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