Title of article
Liquid–Liquid IInterfacial Tension in Ternary Monotectic Alloys Al–Bi–Cu and Al–Bi–Si
Author/Authors
I. Kaban، نويسنده , , W. Hoyer and M. Kehr ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
9
From page
723
To page
731
Abstract
The liquid–liquid iInterfacial tension in the ternary monotectic alloys
Al34.5−x Bi65.5Cux and (Al0.345Bi0.655)100−x Six (mass%) has been determined
as a function of its Cu (Si) coIntent by a tensiometric technique. It is established
that the iInterfacial tension gradually increases when either Cu or Si is
added to Al–Bi alloys. The increase of σαβ can be related to the increase of
the miscibility gap (both width and height) when Cu (Si) is added to the Al–
Bi binary. The temperature dependences of the iInterfacial tension in binary
Al34.5Bi65.5 and ternary Al23.25Bi65.5Cu11.25 and (Al0.345Bi0.655)95Si5 monotectic
alloys are well described by the power function σαβ =σ0 · (1−T/TC)μ
with the critical-point exponent μ=1.3.
Keywords
silicon. , copper , iInterfacial tension , Bismuth , immiscibility , aluminum
Journal title
International Journal of Thermophysics
Serial Year
2007
Journal title
International Journal of Thermophysics
Record number
427469
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