Title of article :
System on Chip or System on Package?
Author/Authors :
Rao R. Tummala Vijay K. Madisetti ، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Pages :
9
From page :
48
To page :
56
Abstract :
The authors propose a new system design paradigm, the system on package, which uses electronic product reengineering to meet time-to-market and performance requirements. The system on package promises a higher return on investment than the system on chip
Journal title :
IEEE Design and Test of Computers
Serial Year :
1999
Journal title :
IEEE Design and Test of Computers
Record number :
431232
Link To Document :
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