Title of article
System on Chip or System on Package?
Author/Authors
Rao R. Tummala Vijay K. Madisetti ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
9
From page
48
To page
56
Abstract
The authors propose a new system design paradigm, the system on package, which uses electronic product reengineering to meet time-to-market and performance requirements. The system on package promises a higher return on investment than the system on chip
Journal title
IEEE Design and Test of Computers
Serial Year
1999
Journal title
IEEE Design and Test of Computers
Record number
431232
Link To Document