• Title of article

    System on Chip or System on Package?

  • Author/Authors

    Rao R. Tummala Vijay K. Madisetti ، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 1999
  • Pages
    9
  • From page
    48
  • To page
    56
  • Abstract
    The authors propose a new system design paradigm, the system on package, which uses electronic product reengineering to meet time-to-market and performance requirements. The system on package promises a higher return on investment than the system on chip
  • Journal title
    IEEE Design and Test of Computers
  • Serial Year
    1999
  • Journal title
    IEEE Design and Test of Computers
  • Record number

    431232