Title of article :
System on Chip or System on Package?
Author/Authors :
Rao R. Tummala
Vijay K. Madisetti
، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Abstract :
The authors propose a new system design paradigm, the system on package, which uses electronic product reengineering to meet time-to-market and performance requirements. The system on package promises a higher return on investment than the system on chip
Journal title :
IEEE Design and Test of Computers
Journal title :
IEEE Design and Test of Computers