Title of article
Soft-Spot Analysis: Targeting Compound Noise Effects in Nanometer Circuits
Author/Authors
Shiming Liu and Chong Zhao، نويسنده , , University of California، نويسنده , , San Diego Sujit Dey، نويسنده , , University of California، نويسنده , , San Diego Xiaoliang Bai، نويسنده , , Cadence Design Systems، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2005
Pages
14
From page
362
To page
375
Abstract
Soft-spot analysis identifies regions in a circuit that are most susceptible to multiple noise sources and their compound effects so that designers can harden those spots for greater robustness. HSpice simulation validates the methodologyʹs quality, and demonstration on a commercial embedded processor shows its scalability.
Journal title
IEEE Design and Test of Computers
Serial Year
2005
Journal title
IEEE Design and Test of Computers
Record number
431596
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