Bridging the Processor-Memory Performance Gapwith 3D IC Technology

The theme of the 2005 International Test Conference is “Test: Survival of the Fittest.” In conjunction with this yearʹs ITC, this special section examines how test helps the fittest of the industryʹs chips, boards, and systems survive manufacturing to reach its customers. These articles discuss topics such as X-tolerant test response compaction, reducing yield loss using a constrained ATPG, and using IDDQ testing with todayʹs high background currents.