Title of article :
Cell Phone Integration: SiP, SoC, and PoP
Author/Authors :
Peter Rickert، نويسنده , , Texas Instruments
William Krenik، نويسنده , , Texas Instruments
، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2006
Abstract :
Engineers must make many cost-effective decisions during a productʹs design cycle. One challenge is deciding on the best packaging for their products. This article presents trade-offs among system-in-package, system-on-chip, and package-on-package integration for mobile phone applications
Journal title :
IEEE Design and Test of Computers
Journal title :
IEEE Design and Test of Computers
