Title of article :
System-in-Package Testing: Problems and Solution
Author/Authors :
Davide Appello، نويسنده , , STMicroelectronics
Paolo Bernardi، نويسنده , , Politecnico di Torino
Michelangelo Grosso، نويسنده , , Politecnico di Torino
Matteo Sonza Reorda، نويسنده , , Politecnico di Torino
، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2006
Abstract :
System-in-package integrates multiple dies in a common package. Therefore, testing SiP technology is different from system-on-chip, which integrates multiple vendor parts. This article provides test strategies for known good die and known good substrate in the SiP. Case studies prove feasibility using the IEEE 1500 test structure
Journal title :
IEEE Design and Test of Computers
Journal title :
IEEE Design and Test of Computers
