Title of article :
FSA SiP Market and Patent Analysis Report
Author/Authors :
FSA SiP subcommittee، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2007
Abstract :
This paper provides an in-depth introduction and analysis on system-in-package (SiP) technology by discussing SiP market perspectives and related SiP patent issues.
Journal title :
IEEE Design and Test of Computers
Journal title :
IEEE Design and Test of Computers
