Title of article :
Simulation of Silver Thin Filmsʹ Growth and Influence of Deposition Rate on Final Grain Size under Angle Flux and Standard Situation
Author/Authors :
Jamshidnejad ، Maryam نويسنده Department of Physics, Khuzestan Science and Reaserch Branch, Islamic Azad University Ahvaz, I.R. Iran , , Kazeminejad، Iraj نويسنده Department of Physics, Shahid Chamran University, Ahwaz, I.R. Iran , , Razeghizadeh، Alireza نويسنده Department of Physics, Payame Noor University, Ahvaz, I.R. Iran ,
Issue Information :
فصلنامه با شماره پیاپی سال 2011
Pages :
3
From page :
59
To page :
61
Abstract :
In this paper, a 2D stimulation model, FACET, is used for investigation of the relation between micro structure and deposition conditions such as substrate temperature, deposition rate and deposition angle of Ag thin films. It is observed that by increasing the deposition rate in standard conditions providing that the temperature of substrate is low, the average of final grain size is decreased. While, in deposition with angle flux the average of final grain size is increased.
Journal title :
International Nano Letters(INL)
Serial Year :
2011
Journal title :
International Nano Letters(INL)
Record number :
655993
Link To Document :
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