Title of article
Simulation of Silver Thin Filmsʹ Growth and Influence of Deposition Rate on Final Grain Size under Angle Flux and Standard Situation
Author/Authors
Jamshidnejad ، Maryam نويسنده Department of Physics, Khuzestan Science and Reaserch Branch, Islamic Azad University Ahvaz, I.R. Iran , , Kazeminejad، Iraj نويسنده Department of Physics, Shahid Chamran University, Ahwaz, I.R. Iran , , Razeghizadeh، Alireza نويسنده Department of Physics, Payame Noor University, Ahvaz, I.R. Iran ,
Issue Information
فصلنامه با شماره پیاپی سال 2011
Pages
3
From page
59
To page
61
Abstract
In this paper, a 2D stimulation model, FACET, is used for investigation of the relation between micro
structure and deposition conditions such as substrate temperature, deposition rate and deposition angle of Ag thin films. It is observed that by increasing the deposition rate in standard conditions providing that the temperature of substrate is low, the average of final grain size is decreased. While, in deposition with angle flux the average of final grain size is increased.
Journal title
International Nano Letters(INL)
Serial Year
2011
Journal title
International Nano Letters(INL)
Record number
655993
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