Title of article :
Package macromodeling via time-domain vector fitting
Author/Authors :
S.، Grivet-Talocia, نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
-471
From page :
472
To page :
0
Abstract :
This paper addresses the construction of lumped macromodels for package structures. A technique named Time-Domain Vector Fitting (TD-VF) is introduced for the identification of the dominant poles of the structure. This method uses as raw data transient excitations and responses at the ports of the structure. These responses are easily obtained from transient fullwave electromagnetic solvers based, e.g., on Finite Differences. The rational approximation can be easily synthesized into a SPICE-compatible subcircuit providing a broadband approximation to the input-output behavior of the package.
Keywords :
Power-aware
Journal title :
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Serial Year :
2003
Journal title :
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Record number :
66118
Link To Document :
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