Oxygenated chloride-assisted leaching of copper residue

Leaching of a copper residue, produced by selective oxidative leaching of a nickel matte, in oxygenated sulfuric acid solution in the presence of chloride ions was investigated. The leaching behaviors of copper and nickel in the copper residue were determined. The effects of chloride addition, oxygen flowrate, sulfuric acid concentration, and temperature were studied as leaching variables. Addition of chloride in small amounts into the leach slurry was found to enhance copper leaching from the residue.