Title of article
Singular thermal residual stress field near the interface corner of bonded dissimilar materials
Author/Authors
NAN-LING PENG، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2005
Pages
11
From page
387
To page
397
Abstract
In this paper, a cooled composite interface corner consisting of two bonded dissimilar materials
is considered as a plane problem. With the complex variable method, the thermal residual stress
field is studied analytically. It is found that the regular stress term possesses the singularity either of
ln r or ln2
r. The exact expressions for the corresponding singular stress field are presented
Keywords
Interface corner , Stress singularity , wedge paradox , Thermal stresses , Plane elasticity
Journal title
International Journal of Fracture
Serial Year
2005
Journal title
International Journal of Fracture
Record number
828321
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