Title of article
Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range
Author/Authors
W. H. ZHU?، نويسنده , , SHARRY ANG، نويسنده , , S. L. GAN، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2005
Pages
5
From page
1533
To page
1537
Journal title
Journal of Materials Science
Serial Year
2005
Journal title
Journal of Materials Science
Record number
829663
Link To Document