Title of article
Interface phenomena in the B4C/(Me-Ti) systems (Me=Cu, Au and Sn)
Author/Authors
M. AIZENSHTEIN، نويسنده , , N. FROUMIN، نويسنده , , N. Frage، نويسنده , , M. P. DARIEL، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2005
Pages
3
From page
2325
To page
2327
Abstract
Interface structure and wetting behavior in the B4C/(Me-Ti) (M=Cu, Sn, Au) systems
depend on boron solubility in the melt and new phase formation at the interface. Wetting in
the B4C/(Cu-Ti) system may be attributed to direct contact between TiB2, formed at the
interface, and the melt. The equilibrium wetting angle in the B4C/(Sn-Ti) and B4C/(Au-Ti),
reflects probably the formation of a TiCx layer with a carbon content determined by the
activity of titanium in the melt. C 2005 Springer Science + Business Media, Inc.
Journal title
Journal of Materials Science
Serial Year
2005
Journal title
Journal of Materials Science
Record number
829784
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