Title of article
Solid state spreading in the Cu/Cu system
Author/Authors
J. M. MISSIAEN?، نويسنده , , R. VOYTOVYCH، نويسنده , , B. GILLES، نويسنده , , N. EUSTATHOPOULOS، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2005
Pages
5
From page
2377
To page
2381
Abstract
Solid state spreading of copper particles on a copper polycrystalline substrate was
analysed at 1050◦C. A specific procedure was settled to produce pure monocrystalline and
nearly spherical copper particles. Spreading dynamics were analysed from SEM images
and preferential particle/substrate orientations were identified by EBSD. The effect of a
preferential orientation on the spreading kinetics is limited, if any. A general agreement is
found between the kinetic results and numerical calculations of Mullins [1] for mass
transport by surface diffusion under the action of surface curvature gradients. The
experimental kinetics are however significantly more rapid, due to the contribution of other
mechanisms like volume diffusion. C 2005 Springer Science + Business Media, Inc.
Journal title
Journal of Materials Science
Serial Year
2005
Journal title
Journal of Materials Science
Record number
829793
Link To Document