Title of article
Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders
Author/Authors
Y. NAKAMURA، نويسنده , , T. Ono، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2005
Pages
3
From page
3267
To page
3269
Journal title
Journal of Materials Science
Serial Year
2005
Journal title
Journal of Materials Science
Record number
829954
Link To Document