• Title of article

    Tensile behavior and deformation mechanisms of bulk ultrafine-grained copper

  • Author/Authors

    S. J. Xie، نويسنده , , P. K. Liaw، نويسنده , , T. H. Choo، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2006
  • Pages
    5
  • From page
    6328
  • To page
    6332
  • Abstract
    The tensile behaviors of the ultrafinegrained (UFG) pure copper prepared by cold rolling have been investigated. The UFG-Cu exhibited high strengths and low ductility. The ductile dimple-like fracture surfaces and persistent-slip-bands (PSBs)-like local shear bands in the tension-deformed UFG-Cu were observed, both of which typically spanned tens of grain sizes. This observation indicated that the fracture mechanisms operated at a larger scale than the grain size and eventually involved collective grain activities. Moreover, localized shear bands provided the experimental evidence to the localized plastic deformation, which was the one of the dominant reasons, causing the low ductility in the UFG-Cu
  • Journal title
    Journal of Materials Science
  • Serial Year
    2006
  • Journal title
    Journal of Materials Science
  • Record number

    832100