a Transition of polyamide 6 in chemically bonded polyamide 6/polytetrafluoroethylene compounds studied by dynamic mechanical thermal analysis and dielectric thermal analysis

The a transition of polyamide 6 (PA 6) component in chemically bonded PA 6/polytetrafluoroethylene (PTFE) compounds is studied by dynamic mechanical thermal analysis (DMTA) and dielectric thermal analysis (DETA). It is found that DMTA shows better compatibility between two components than DETA does. It is also found that at the a transition temperature of PA 6 component (Ta PA 6), the dynamic mechanical response of PTFE component is remarkable while its dielectric response is negligible. The effect of PTFE component on the segmental mobility of PA 6 component is discussed on the basis of DMTA, DETA and differential scanning calorimetry (DSC) results and the chemical bonding effect is found to play the dominant role. The measurement of apparent activation energy (DEa) shows that the addition of PTFE component reduces the cooperativity of the a transition of PA 6 component.