Title of article :
Comparison of failure mechanisms between rubber-modified
and unmodified epoxy adhesives under mode II loading condition
Author/Authors :
Makoto Imanaka، نويسنده , , Ryousuke Orita، نويسنده , ,
Yosinobu Nakamura، نويسنده , , Masaki Kimoto، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2008
Abstract :
The effect of rubber modification on fracture
toughness of adhesive joints under mode II loading condition
was investigated in comparison with that under
mode I loading, wherein the two adhesives rubber-modified
and unmodified were used. To evaluate the fracture
toughness on the basis of R-curve characteristics under
mode II loading condition, four-point bend tests had been
conducted for the adhesively bonded end-notched flexure
(ENF) specimens. Thus obtained R-curves revealed the
following trend: its behavior did not appear for the
unmodified adhesive, whereas the rubber-modified adhesive
exhibited a typical behavior. In the initial stage of
crack propagation, GIIC of the rubber-modified adhesive is
lower than that of the unmodified adhesive, but becomes
greater in the range of Da[25 mm. Nevertheless, the
significant improvement of the fracture toughness with the
rubber modification under mode I loading condition was
not observed under mode II loading. Moreover, FEM
analysis was made to elucidate the relation between the
above fracture behavior and stress distributions near the
crack tip. The results gave the reasonable relationship
between evolution of plastic zone and the area with high
void-fraction as well as the R-curves behavior. In addition,
macroscopic and SEM observations for the fracture
surfaces were also conducted
Journal title :
Journal of Materials Science
Journal title :
Journal of Materials Science