Coupling kinetic dislocation model and Monte Carlo algorithm for recrystallized microstructure modeling of severely deformed copper

By coupling a kinetic dislocation model and Monte Carlo algorithm, the recrystallized microstructure of severely deformed Oxygen Free High Conductivity Copper (OFHC) is predicted at different strains imposed by Equal- Channel-Angular-Pressing (ECAP) and annealing temperatures. From a flow field model, the strain rate distribution during the ECAP of the material in a curved die is calculated. Then using the kinetic dislocation model, the total dislocation density and correspondingly the stored energy after each ECAP pass is estimated. Utilizing the Monte Carlo algorithm and the stored energy, the recrystallized microstructure is predicted. The results show that the recrystallized grain size is decreased rapidly from the strain of first to fourth pass and then it is decreased slowly. Also, it is achieved that with increasing the annealing temperature, the grain size is increased. Moreover, a good agreement is observed between the predicted results and experimental data.