Title of article :
Impact of low-impedance substrate on power supply integrity
Author/Authors :
R.، Panda, نويسنده , , S.، Sundareswaran, نويسنده , , D.، Blaauw, نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Abstract :
Although it is tempting to think of the power grid as an independent medium of the transfer of energy from the package to the devices in the IC, some second-order technology-related effects can sometimes cause unforeseen problems. This article focuses especially on the relationship of the power delivery system to the silicon substrate properties, and shows how a low-impendance substrate can make a substantial difference in the noise generated by the power grid.
Journal title :
IEEE Design and Test of Computers
Journal title :
IEEE Design and Test of Computers