Title of article :
Wafer-package test mix for optimal defect detection and test time savings
Author/Authors :
P.C.، Maxwell, نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
-83
From page :
84
To page :
0
Abstract :
For years, it has been common to run a test at wafer and then exactly the same test again at package. This article shows how one company took a detailed look at the wafer/package test mix and adjusted it to reduce cost while retaining quality.
Keywords :
leukemia
Journal title :
IEEE Design and Test of Computers
Serial Year :
2003
Journal title :
IEEE Design and Test of Computers
Record number :
90301
Link To Document :
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