Title of article :
Wafer-package test mix for optimal defect detection and test time savings
Author/Authors :
P.C.، Maxwell, نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Abstract :
For years, it has been common to run a test at wafer and then exactly the same test again at package. This article shows how one company took a detailed look at the wafer/package test mix and adjusted it to reduce cost while retaining quality.
Journal title :
IEEE Design and Test of Computers
Journal title :
IEEE Design and Test of Computers