A coupled electromechanical analysis of a piezoelectric layer bonded to an elastic substrate: Part I, development of governing equations

This two-part contribution presents a novel and efficient method to analyze the two-dimensional (2-D) electromechanical fields of a piezoelectric layer bonded to an elastic substrate, which takes into account the fully coupled electromechanical behavior. In Part I, Hellinger–Reissner variational principle for elasticity is extended to electromechanical problems of the bimaterial, and is utilized to obtain the governing equations for the problems concerned. The 2-D electromechanical field quantities in the piezoelectric layer are expanded in the thickness-coordinate with seven one-dimensional (1-D) unknown functions. Such an expansion satisfies exactly the mechanical equilibrium equations, Gauss law, the constitutive equations, two of the three displacement–strain relations as well as one of the two electric field-electric potential relations. For the substrate the fundamental solutions of a half-plane subjected to a vertical or horizontal concentrated force on the surface are used. Two differential equations and two singular integro-differential equations of four unknown functions, the axial force, N, the moment, M, the average and the first moment of electric displacement, D0 and D1, as well as the associated boundary conditions have been derived rigorously from the stationary conditions of Hellinger–Reissner variational functional. In contrast to the thin film/substrate theory that ignores the interfacial normal stress the present one can predict both the interfacial shear and normal stresses, the latter one is believed to control the delamination initiation.