Stress voiding and electromigration phenomena in aluminum alloys

The causes of stress voiding and electromigration in aluminum alloys are reviewed. An overview of characterization techniques is given along with some simulation results on the influence of line geometry on the mechanical stress. Stress voiding and electromigration behavior of various aluminum alloys is presented, and the influence of various barrier layers and anti-reflective coatings is discussed. The adverse influence of the addition of silicon to Al alloys is presented together with supporting Auger and TEM measurements. Finally, the volume distribution of the stress voids is presented.