Effect of deposition conditions for g-aminopropyltriethoxy silane on adhesion between copper and epoxy resins

By investigating the pretreatment conditions of copper plates with g-aminopropyltriethoxy silane g-APS.alcoholic solution, we have demonstrated that the deposition conditions have a significant effect on the adhesion and the durability of copperrepoxy joints. The thickness and the structure of the primer, the existence of metal ions in the interphase and the interaction and the interdiffusion of the primer with the epoxy resins contribute together to the effect.