Abstract :
The semiconductor market has been experiencing remarkable expansion, with a CGR approaching 30% over the last half
decade. This growth has been driven by continuing device miniaturization and the attendant increase in integration level and
performance and decrease in cost. However, as devices become smaller, there is concern that fundamental limits will rest&t
further progress. Possible fundamental limits to device miniaturization and chip performance are considered. It is shown that
while there are such limits, devices into the deep sub-O.1 mm region with acceptable characteristics could be built, providing
that practical considerations in such areas as fabrication and lithography, design complexity, interconnect delay and
fabrication facility cost can be overcome.