Abstract :
A thin Ag film, which was formed on an insulator substrate using the ion beam deposition method, has an insufficient
structure by the electro-migration effect caused by the electric charge left in the film.
In contrast to the ion beam deposition method, the result was satisfactory when direct current flows were applied to the
film during its forming. The results of an SiO2 substrate were better than those for a Pyrex glass PG.substrate.
Using the direct current method, we formed a thin Ag film onto an SiO2 substrate of 55 nm thickness and 1.0 nm native
oxide. Experiments were carried out with a base pressure of 1.5=10y7 Pa at room temperature RT., and film was
examined using X-ray diffraction XRD., Auger electron spectroscopy AES.and scanning tunneling microscopy STM..
q2000 Elsevier Science B.V. All rights reserved.
Keywords :
Thin Ag film , Electro-migration , Dielectric relaxation , leakage current