• Title of article

    Low RF noise and power loss for ion-implanted Si having an improved implantation process

  • Author/Authors

    J.، Liu, نويسنده , , A.، Chin, نويسنده , , K.T.، Chan, نويسنده , , S.P.، McAlister, نويسنده , , D.S.، Duh, نويسنده , , W.J.، Lin, نويسنده , , C.Y.، Chang, نويسنده , , S.C.، Chien, نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2003
  • Pages
    -27
  • From page
    28
  • To page
    0
  • Abstract
    Very-low-transmission line noise of <0.25 dB at 18 GHz and low power loss <0.6 dB at 110 GHz have been measured on transmission lines fabricated on proton-implanted Si. In contrast, a standard Si substrate gave much higher noise of 2.5 dB and worse power loss of 5 dB. The good RF integrity of proton-implanted Si results from the high isolation impedance to ground, as analyzed by an equivalent circuit model. The proton implantation is also done after forming the transmission lines at a reduced implantation energy of ~4 MeV. This enables easier process integration into current VLSI technology.
  • Keywords
    heat transfer , natural convection , Analytical and numerical techniques
  • Journal title
    IEEE Electron Device Letters
  • Serial Year
    2003
  • Journal title
    IEEE Electron Device Letters
  • Record number

    99879