Title of article :
Low RF noise and power loss for ion-implanted Si having an improved implantation process
Author/Authors :
J.، Liu, نويسنده , , A.، Chin, نويسنده , , K.T.، Chan, نويسنده , , S.P.، McAlister, نويسنده , , D.S.، Duh, نويسنده , , W.J.، Lin, نويسنده , , C.Y.، Chang, نويسنده , , S.C.، Chien, نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
-27
From page :
28
To page :
0
Abstract :
Very-low-transmission line noise of <0.25 dB at 18 GHz and low power loss <0.6 dB at 110 GHz have been measured on transmission lines fabricated on proton-implanted Si. In contrast, a standard Si substrate gave much higher noise of 2.5 dB and worse power loss of 5 dB. The good RF integrity of proton-implanted Si results from the high isolation impedance to ground, as analyzed by an equivalent circuit model. The proton implantation is also done after forming the transmission lines at a reduced implantation energy of ~4 MeV. This enables easier process integration into current VLSI technology.
Keywords :
heat transfer , natural convection , Analytical and numerical techniques
Journal title :
IEEE Electron Device Letters
Serial Year :
2003
Journal title :
IEEE Electron Device Letters
Record number :
99879
Link To Document :
بازگشت