Adhesion behavior of electroless deposited Cu on Pt/Ta silicate and Pt/SiO2

X-ray photoelectron spectroscopy (XPS) was used to characterize the growth mode of sputter deposited Pt at 300 K on Ta silicate and SiO2 thin films formed on a Si(1 0 0) substrate. The ability of Pt thin films to catalyze electroless Cu deposition on Ta silicate and SiO2 was also studied. The XPS data show that Pt deposition results in conformal growth or ‘‘wetting’’ on Ta silicate and 2-D cluster growth on SiO2. Electroless Cu deposition on 11 monolayers (MLs) Pt/Ta silicate film results in an adherent Cu film which passed the Scotch tape test. In contrast, electroless Cu deposition on 11 ML Pt/SiO2 results in a non-adherent Cu film due to weak Pt/SiO2 interaction. # 2003 Elsevier B.V. All rights reserved.