Silicalite-1/polymer films with low-k dielectric constants

Two-component films including nanosized silicalite-1 zeolite and acryl latex were deposited on silicon wafers via spincoating approach. The first stage of the preparation included spin-on of as-synthesized or purified colloidal zeolite suspensions of silicalite-1 (MFI-type topology) nanoparticles with sizes of 30 and 60 nm. After calcination of the zeolite films a layer of acryl latex was deposited. The porous silicalite-1/polymer films have high mechanical stability and dielectric constant in the range of 2.0–2.5. The porous nature, thickness and disorientation of the silicalite-1/polymer nanoparticles forming the films determine them as very promising low dielectric constant materials useful as insulating films in microelectronics. # 2003 Elsevier B.V. All rights reserved