DocumentCode
10711
Title
Thermal and Thermo-Mechanical Analyses of Wire Bond vs. Three-dimensionally Packaged Power Electronics Modules
Author
Guo-Quan Lu استاد راهنما , Burhan Ozmat استاد مشاور , Douglas J. Nelson استاد مشاور
University
Virginia Polytechnic Institute and state University
Grade
نامعلوم
Major
Master of Science )Power Electronics Systems(
Number of pages
0
Publish Date
1999
Keyword
finite element modeling , Power Electronics , thermal , 3D packaging , thermo-mechanical
Note
01
Language
انگليسي
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