Title :
Thermal and Thermo-Mechanical Analyses of Wire Bond vs. Three-dimensionally Packaged Power Electronics Modules
Author :
Guo-Quan Lu استاد راهنما , Burhan Ozmat استاد مشاور , Douglas J. Nelson استاد مشاور
University :
Virginia Polytechnic Institute and state University
Major :
Master of Science )Power Electronics Systems(
Keyword :
finite element modeling , Power Electronics , thermal , 3D packaging , thermo-mechanical
