Title :
High Temperature SiC Embedded Chip Module )ECM( with Double-sided Metallization Structure
Author :
Guo-Quan Lu استاد مشاور , Elaine P. Scott استاد مشاور , Willem G. Odendaal استاد مشاور , Jacobus Daniel van Wyk استاد راهنما
University :
Virginia Polytechnic Institute and state University
Major :
PhD )Electrical and Computer Engineering(
Keyword :
thermo-mechanical analysis , thermal analysis , electronic packaging , high temperature , 3-D , integrated power electronics module , embedded chip module
