DocumentCode
1277
Title
Chemical Vapor Deposition of Thin Films for ULSI Interconnect Metallization
Author
Andrew W. Maverick استاد مشاور , Kerry M. Dooley استاد مشاور , Douglas P. Harrison استاد مشاور , Gregory L.Griffin استاد راهنما
University
Lovisiana State University
Grade
دكتري
Major
Doctor of Philosophy )Ph.D.( )Chemical Engineering(
Number of pages
0
Publish Date
2005
Keyword
interconnect metallization , Cu)hfac(2 , Copper , Reaction Mechanism , chemical vapor deposition , TaF5 , barrier layer , electroless deposition , SiH4 , seed layer , Pd)hfac(2 , tantalum , PALLADIUM
Note
01
Language
انگليسي
Link To Document