DocumentCode :
13609
Title :
EXPERIMENTAL AND NUMERICAL INVESTIGATIONS ON THE DURABILITY AND FRACTURE MECHANICS OF THE BONDED SYSTEMS FOR MICROELECTRONICS APPLICATION
Author :
David A. Dillard استاد راهنما , John G. Dillard استاد مشاور , John J. Lesko استاد مشاور
University :
Virginia Polytechnic Institute and state University
Grade :
نامعلوم
Major :
PhD )Engineering Science and Mechanics(
Number of pages :
0
Publish Date :
2003
Keyword :
epoxy-glass interface , Residual stress , Temperature , Coating , subcritical crack growth , Thin film , simply-supported , Fracture mechanics , bending , Adhesion , blister test , interfacial fracture energy , clamp , diffusion , spacer , single-lap joint , wedge test , Stretching , thermal residual stresses , Adhesion , Delamination , Boundary conditions
Note :
01
Language :
انگليسي
Link To Document :
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