DocumentCode
1823
Title
Electrodeposition of Nickel-Copper Alloys and Nickel-Copper-Alumina Nanocomposites into Deep Recesses for MEMS
Author
Julia Chan استاد مشاور , Kalliat. T. Valsaraj استاد مشاور , Elizabeth. J. Podlaha استاد راهنما
University
Lovisiana State University
Grade
دكتري
Major
Doctor of Philosophy )Ph.D.( )Chemical Engineering(
Number of pages
0
Publish Date
2003
Keyword
nanocomposites , Pulse plating , Copper , MEMS , Microstructures , LIGA , Alloys , nickel , Electrodeposition
Note
01
Language
انگليسي
Link To Document