DocumentCode :
1823
Title :
Electrodeposition of Nickel-Copper Alloys and Nickel-Copper-Alumina Nanocomposites into Deep Recesses for MEMS
Author :
Julia Chan استاد مشاور , Kalliat. T. Valsaraj استاد مشاور , Elizabeth. J. Podlaha استاد راهنما
University :
Lovisiana State University
Grade :
دكتري
Major :
Doctor of Philosophy )Ph.D.( )Chemical Engineering(
Number of pages :
0
Publish Date :
2003
Keyword :
nanocomposites , Pulse plating , Copper , MEMS , Microstructures , LIGA , Alloys , nickel , Electrodeposition
Note :
01
Language :
انگليسي
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=17&DC=1823
