• DocumentCode
    20028
  • Title

    Wafer Level Chip Scale Packaging Using Wafer Bonder

  • Author

    Pratul K. Ajmera استاد راهنما , Jin-Woo Choi استاد مشاور , Bingqing Wei استاد مشاور

  • University
    Lovisiana State University
  • Grade
    نامعلوم
  • Major
    Master of Science in Electrical Engineering )M.S.E.E.( )Electrical Computer Engineering(
  • Number of pages
    0
  • Publish Date
    2005
  • Keyword

    glass etching , anodic bonding , silicon etching , WLCSP , wafer bonder

  • Note
    01
  • Language
    انگليسي
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=17&DC=20028