Title :
EFFECT OF INTERMETALLIC COMPOUNDS ON THERMOMECHANICAL RELIABILITY OF LEAD-FREE SOLDER INTERCONNECTS FOR FLIP-CHIPS
Author :
Rao R. Tummala استاد راهنما , C P Wong استاد مشاور , Suresh استاد مشاور
University :
Georgia Institute Of Technology
Major :
Master of Science
Keyword :
submodelling , FEM , Intermetallic , lead-free solder
