DocumentCode
26239
Title
EFFECT OF INTERMETALLIC COMPOUNDS ON THERMOMECHANICAL RELIABILITY OF LEAD-FREE SOLDER INTERCONNECTS FOR FLIP-CHIPS
Author
Rao R. Tummala استاد راهنما , C P Wong استاد مشاور , Suresh استاد مشاور
University
Georgia Institute Of Technology
Grade
نامعلوم
Major
Master of Science
Number of pages
0
Publish Date
2004
Keyword
submodelling , FEM , Intermetallic , lead-free solder
Note
01
Language
انگليسي
Link To Document