DocumentCode
3954
Title
AIR-GAPS VIA THERMALLY DECOMPOSABLE POLYMERS AND THEIR APPLICATION TO COMPLIANT WAFER LEVEL PACKAGING )CWLP(
Author
Kohl Paul A. استاد مشاور , Martin Kevin P. استاد مشاور , Bidstrup Allen Sue Ann استاد راهنما
University
Georgia Institute Of Technology
Grade
دكتري
Major
Doctor of Philosophy
Number of pages
0
Publish Date
2004
Keyword
compliant interconnection , Sea of Leads )SoL( , Muhannad S. Bakir , polynorbornene
Note
01
Language
انگليسي
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