DocumentCode :
4131
Title :
Moisture and Interfacial Adhesion in Microelectronic Assemblies
Author :
C. P. Wong استاد مشاور , S. Mostafa Ghiaasiaan استاد مشاور , Jianmin Qu استاد راهنما
University :
Georgia Institute Of Technology
Grade :
دكتري
Major :
Doctor of Philosophy
Number of pages :
0
Publish Date :
2004
Keyword :
electronic , Packaging , fracture , Adhesion , Toughness , Moisture
Note :
01
Language :
انگليسي
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=17&DC=4131
