DocumentCode
4131
Title
Moisture and Interfacial Adhesion in Microelectronic Assemblies
Author
C. P. Wong استاد مشاور , S. Mostafa Ghiaasiaan استاد مشاور , Jianmin Qu استاد راهنما
University
Georgia Institute Of Technology
Grade
دكتري
Major
Doctor of Philosophy
Number of pages
0
Publish Date
2004
Keyword
electronic , Packaging , fracture , Adhesion , Toughness , Moisture
Note
01
Language
انگليسي
Link To Document