DocumentCode
5913
Title
Measurement, optimization and multiscale modeling of silicon wafer bonding interface fracture resistance
Author
Delannay Francis استاد راهنما , Dewolf Ingrid استاد مشاور
University
UCL )Les Bibliotheques de L,Universite Catholique de Louvain(
Grade
دكتري
Major
FSA 3 - Doctorat en sciences appliqu{ف }es
Number of pages
0
Publish Date
2006
Keyword
Wafer bonding , Interface toughness , multiscale modeling
Note
01
Language
انگليسي
Link To Document