Using Wet Dry Etching technologies to etch Si-Wafers

In this paper used wet etching and dry etching technologies to etch Si-pType samples, the result were: - * wet etching (Isohopic etch, low damage on the surface, High selectivity, Smooth surface). *dry etching (Anisotropic etch, High damage on the surface, [ow selectivity, Roughness surface). Therefore, we can say that Dry or plasma etching has presented solutions to virtually all of the difficulties associated with wet etching.