Evaluation of metallic thin films Adhesion on glass substrate using pulsed laser technique

The adhesion test of thin films on substrates constitutes a major industrial challenge particular in the field of materials processing. Most of common techniques are based on tensile or scratch test, but few of them provide a real measurement of adhesion. In recent years, laser methods have been applied across a wide variety of materials to measure adhesion between a thin film and a substrate. In this study, chromium and copper thin films were deposited by evaporation and sputtering methods on glass substrates in various deposition conditions to conduct pull-off test and to investigate influence of laser on interface of thin films and substrates. For this purpose, a nanosecond pulsed Nd:YVO4 Laser applied to metallic layer. The irradiated samples examined by Optical and Atomic Forced Microscopy to analyses the surface alterations. Adhesion of thin films studied with respect to the area of affected regions. Results demonstrated that the destructive influence of laser on thin films decreased by increasing the adhesion strength, as expected; the smaller flaked regions and lower swelled out layers were observed in thin films deposited at higher temperature of substrate.