شماره ركورد كنفرانس :
4560
عنوان مقاله :
Experimental investigation on thermal residual stresses effects on fatigue crack growth of repaired panels bonded with FMLs
Author/Authors :
A Vojdani Department of Mechanical Engineering - Amirkabir University of Technology, Tehran , M Sadighi Department of Mechanical Engineering - Amirkabir University of Technology, Tehran , H Hosseini-Toudeshky Department of Aerospace Engineering - Amirkabir University of Technology, Tehran
كليدواژه :
Thermal residual stress , Fiber Metal Laminate , Repair , Fatigue crack growth
عنوان كنفرانس :
The International Conference on Experimental Solid Mechanics and Dynamics ۲۰۱۲
چكيده لاتين :
Thermal residual stresses due to the curing cycle of the bonded composite patch affects the stress/strain states and the crack patching efficiency of single-side repaired aluminum panels. In this study the thermal residual stresses that occur as a result of the thermal expansion coefficient mismatch between the patch and the underlying cracked aluminum panel are investigated. The fatigue crack-growth life of centrally cracked aluminum panels in mode-І condition are studied with single repairs of Fiber Metal Laminate (FML) patches that are manufactured using alternating layers of aluminum and glass fiber- epoxy. Sensitivity of the curing temperature on fatigue crack growth life extension on repaired panels are also investigated. Because of using FML patches with thermal expansion coefficient commensurate with aluminum panels, it is showed that against the behavior of usual composite patches such as boron/epoxy, various curing temperature cycles do not affect the thermal residual stress and crack- growth life of specimens significantly.
